openNews
02-16-2010, 08:24 PM
Bug Labs (www.buglabs.net), the open hardware development platform for prototyping and deploying electronics devices, unveiled at the Mobile World Congress its second-generation hardware system, BUG 2.0. Updated features include a speedy Cortex A8-based OMAP3 core from the original BUGBase’s ARM11. The new version is based on the OMAP™ 3 platform from Texas Instruments Incorporated (www.ti.com)(TI) and supports the popular BeagleBoard by seamlessly running all applications written for that device.
BUG 2.0 comprising of unique modular hardware system, integrated web services, and related apps has now added support for Android, allowing developers to port current Android apps to the BUG as well as create new apps that utilize BUG’s modules to create new Android-based hardware applications. Current Android applications can be ported directly to the BUG hardware, giving developers a new platform to expand on these apps and add significant functionality through open hardware. Further, Android developers can now build devices that span far beyond typical consumer-focused needs, such as in the healthcare, M2M and telematics industries. Price and availability are yet to be announced.
More here: http://www.prweb.com/releases/BUG2/021510/prweb3604834.htm (http://www.prweb.com/releases/BUG2/021510/prweb3604834.htm)
BUG 2.0 comprising of unique modular hardware system, integrated web services, and related apps has now added support for Android, allowing developers to port current Android apps to the BUG as well as create new apps that utilize BUG’s modules to create new Android-based hardware applications. Current Android applications can be ported directly to the BUG hardware, giving developers a new platform to expand on these apps and add significant functionality through open hardware. Further, Android developers can now build devices that span far beyond typical consumer-focused needs, such as in the healthcare, M2M and telematics industries. Price and availability are yet to be announced.
More here: http://www.prweb.com/releases/BUG2/021510/prweb3604834.htm (http://www.prweb.com/releases/BUG2/021510/prweb3604834.htm)